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GB/T 29545-2013机床数控系统 可靠性设计

本标准规定了机床数控系统可靠性设计的基本流程、方法以及评审内容和程序。本标准适用于机床数控系统(以下简称“数控系统”)。其他工业机械设备数控系统的可靠性设计可参照本标准。

GB/T 30067-2013金相学术语

本标准界定了金相学和金相检验及其相关领域的术语,主要涵盖了光学显微术、显微压痕硬度测试、样品制备、X-射线和电子金相学、定量金相学、显微摄影术、晶粒尺寸和夹杂物含量的测定等金相学领域中广泛使用的专有名词。本标准适用于金相学领域中的科研、生产、检验、教学、出版、编制标准及国内外科技交流。

GB/T 50668-2011节能建筑评价标准

为贯彻落实节约能源资源的基本国策，引导采用先进适用的建筑节能技术，推动建筑的可持续发展，规范节能建筑的评价，编制本标准。本标准适用于新建、改建和扩建的居住建筑和公共建筑的节能评价。节能建筑评价应符合下列规定：节能建筑的评价应包括建筑及其用能系统，涵盖设计和运营管理两个阶段；节能建筑的评价应在达到适用的室内环境的前提下进行。 节能建筑的评价除应符合本标准的规定外，尚应符合现行有关标准的规定。

GB 50681-2011机械工业厂房建筑设计规范

本规范适用于下列范围：1 新建、扩建、改建的机械工业厂房及其附属建筑的建筑设计；2 机械工业工厂中电离辐射室的建筑设计；3 机械工业工厂中电磁屏蔽室，屏蔽频率为0.15MHz～30MHz利用建筑物增设屏蔽层的建筑设计。

CECS 411-2015金属面绝热夹芯板技术规程

本规程适用于工业与民用建筑屋面板(非上人屋面)、墙面板、天花板、内隔墙、声屏障等的设计及安装。

SJ/Z 21336-2018数据链设备可靠性设计指南

本指导性技术文件规定了数据链设备可靠性设计的一般要求、设计准则和设计方法等。本指导性技术文件适用于指导数据链终端设备(含天线)、链路综合处理设备、网络管理设备等的可靠性设计，其他数据链设备可参考使用。

DB11/T 512-2007建筑装饰工程石材应用技术规程

本规程适用于建筑装饰工程中装饰石材的材料、设计、加工制作、施工、验收以及防护、保养和翻新。

ISO/TTA 4-2002硅基质上薄膜导热性的测量

1.1 A standard procedure for the three-omega method is proposed for measuring the thermal conductivity ofa thin, electrically insulating film, on a substrate having a thermal conductivity significantly greater than thethermal conductivity of the film. This method is applicable to a film on a silicon substrate with the followingcharacteristics:a) the film is electrically insulating;b) the film has a thermal conductivity that is less than one tenth the thermal conductivity of silicon;c) the film is uniform in thickness and the thickness lies in the range 0,25 μm to 1 μm;d) the maximum dimensions of the film are limited by the sizes of the preparation and measurementapparatus;e) the minimum dimensions of the film are limited by the minimum size of the circuit element that can beplaced on the film surface.NOTE A specimen approximately 15 mm by 25 mm is of an appropriate size although specimens as small as10 mm × 10 mm are usable.1.2 The method is directly applicable to films of silicon dioxide on silicon wafer substrates.1.3 The method may be applicable to insulating films on other high-thermal conductivity substrates providedthat the parameters of the substrate material are substituted for the parameters of silicon used in this methodand the associated computer program.1.4 The method is applicable to measurements near room temperature.

DIN EN 675-2011建筑玻璃.热传递系数(U值)测定.热流计法;德文版本EN 675-2011

This European Standard specifies a measurement procedure to determine the thermal transmittance of glazing with flat and parallel surfaces. Structured surfaces, e.g. patterned glass, may be considered to be flat...

DIN EN ISO 472-2013塑料.词汇表(ISO 472-2013).三种语言版本EN ISO 472-2013

This standard defines terms used in the plastics industry, including terms and definitions appearing in plastics standards (of ISO/TC 61), and general terms and definitions of polymer science used in all aspects of plastics technology.

BS EN 675-2011建筑玻璃.热传递系数(U值)的测定.热流计法

This European Standard specifies a measurement procedure to determine the thermal transmittance ofglazing with flat and parallel surfaces. For the purpose of this Standard, structured surfaces may beconsidered to be flat..This European Standard applies to multiple glazing with outer panes which are not transparent to far infraredradiation (in the wavelength range 5μm to 50μm), which is the case for soda lime silicate glass products,borosilicate glass and glass ceramics. Internal elements can be far infrared transparent.The procedure specified in this European Standard determines the U value (thermal transmittance) in thecentral area of glazing. The edge effects due to the thermal bridge through the spacer of an insulating glassunit or through the window frame are not included. Energy transfer due to solar radiation is also excluded.The procedure specified in this European Standard should be considered only when the thermal transmittanceof the glazing cannot be calculated in accordance with EN 673.The determination of the thermal transmittance is performed for conditions which correspond to the averagesituation for glazing in practice.

BS EN 60194-2006印制板设计、制造和组装.术语和定义

This International Standard defines the terminology used in the field of printed circuitboards and printed circuit board assembly products.

BS EN 61189-2-2006印制电路板及其互连结构和组件电气材料的试验方法.互连结构材料的试验方法

This part of IEC 61189 provides a catalogue of test methods representing methodologies andprocedures that can be applied to test materials used for manufacturing interconnectionstructures (printed boards) and assemblies.

BS EN 62258-1-2010半导体压模产品.采购和使用

This part of IEC 62258 has been developed to facilitate the production, supply and use ofsemiconductor die products, including• wafers,• singulated bare die,• die and wafers with attached connection structures,• minimally or partially encapsulated die and wafers.The standard defines the minimum requirements for the data that are needed to describe suchdie products and is intended as an aid to the design of and procurement for assembliesincorporating die products. It covers the requirements for data, including• product identity• product data• die mechanical information• test, quality, assembly and reliability information• handling, shipping and storage informationIt covers the specific requirements for the data that are needed to describe the geometricalproperties of die, their physical properties and the means of connection necessary for their usein the development and manufacture of products. It also contains, in the annexes, a vocabularyand list of common acronyms.